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Precision Alignment and Coupling SystemDesigned for optical-electrical packaging
Precision Alignment and Coupling System
Designed for optical-electrical packaging of semiconductor chips, silicon photonic devices, and other passive components, this system provides a highly stable platform for coupling optical fibers (single fiber or FA arrays) with devices such as silicon photonic chips, PLC splitters, AWG arrays, WDM modules, and collimators. It is widely used in both cutting-edge research and industrial production.
The system integrates precision adjustment stages, device fixtures, a chip stage (with optional temperature control), multi-axis microscope observation modules, light sources, optical platforms, optical power meters, probe holders, and UV curing systems. With comprehensive functionality and user-friendly operation, the system supports custom solutions tailored to specific application needs.
The PWS-10M features a fully manual control scheme for high-precision coupling with excellent cost performance. Its modular configuration allows flexible selection based on user needs. Ideal for university and institute-level research, the system also supports optional modules like adhesive dispensing and UV curing, making it suitable for industrial-level packaging applications.
6-axis precision manual adjustment stage
Custom fixtures for optical fibers, waveguide chips, etc.
4-axis adjustable chip stage (optional temperature control)
Multi-dimensional microscopic observation system
Supporting components: probe holders, optical platforms, light sources, optical power meters, dispensers, UV curing units, etc.
Modular design, configurable to match specific application needs
Equipped with imported 6-axis stage, coarse/fine tuning with submicron precision
User-friendly operation, full workflow completed on a single platform
Broad compatibility, supporting silicon photonics, PLC, AWG, WDM, and more
Custom solutions available based on user requirements
Example: PLC Chip-to-Fiber Alignment
Mechanical Setup：Mount the fiber array and chip on the platform using fixtures. Align each component’s plane and height, ensuring coplanarity and initial positioning accuracy. Fine-tune all axes to minimize angular and positional offsets for optimal coupling.
Initial Optical Alignment：Perform coarse optical alignment along X and Y axes. Use live imaging (overlay of oblique and coaxial views) to assess misalignment. Adjust until the input/output ports of the fiber and chip are well aligned and focused. Light coupling signal appears on the CCD once aligned.
Visual Monitoring：With low-power light coupled into the device, monitor the near-field output (typ. 100–200 μm distance) to evaluate alignment. Adjust rotational angle and height as needed. Use image-based alignment and feedback to iteratively optimize coupling. Fine adjustments are made in ≤10 μm steps.
Signal Optimization：Inject signal light and monitor output power to perform fine tuning. Ensure coupling loss is minimized. Complete alignment of each channel one by one.
UV Curing：Once alignment is complete, apply UV curing to fix the device.
Device Removal：Release the fixture, remove the bonded device, and proceed to testing.
Widely applied in core fields such as scientific research and industrial production. coupling for silicon photonic waveguidesoptical fibers (single fiber / FA arrays)AWGWDMPLCcollimatorscovering a wide range of photonic integration needs.
PLCTS provides customized optical coupling solutions tailored to your specific application needs.For more information, please contact us directly.
