Full-Auto-Coupling-System

Precision Alignment and Coupling SystemDesigned for optical-electrical packaging

在线咨询

产品介绍

Precision Alignment and Coupling System
Designed for optical-electrical packaging of semiconductor chips, silicon photonic devices, and other passive components, this system provides a highly stable platform for coupling optical fibers (single fiber or FA arrays) with devices such as silicon photonic chips, PLC splitters, AWG arrays, WDM modules, and collimators. It is widely used in both cutting-edge research and industrial production.

The system integrates precision adjustment stages, device fixtures, a chip stage (with optional temperature control), multi-axis microscope observation modules, light sources, optical platforms, optical power meters, probe holders, and UV curing systems. With comprehensive functionality and user-friendly operation, the system supports custom solutions tailored to specific application needs.

The PWS-HE Series High-Precision Fully Motorized Waveguide Coupling Platform features dual-side 6-axis motorized stages with intelligent software control, delivering exceptional coupling efficiency ideal for high-throughput production environments.

Its modular architecture allows flexible configuration based on specific application needs, making it a preferred solution for industrial photonic packaging. Optional modules such as adhesive dispensing and UV curing are available to support end-to-end automated coupling and packaging workflows.

Core Modules：

6-DOF Precision Adjustment Stage, 6 Axis Motorized Control, and Software Operation for high-accuracy, automated alignment.
Custom fixtures for optical fibers, waveguide chips, etc.
4-axis adjustable chip stage (optional temperature control)
Multi-dimensional microscopic observation system
Supporting components: probe holders, optical platforms, light sources, optical power meters, dispensers, UV curing units, etc.

Technical Advantages：

Modular design, configurable to match specific application needs
Equipp
ed with an imported 6-DOF adjustment stage, nanometer-level precision.
User-friendly operation, full workflow completed on a single platform
Broad compatibility, supporting silicon photonics, PLC, AWG, WDM, and more
Custom solutions available based on user requirements

Module Selection & Specifications:

Module	Model	Qty	Description / Key Specs
6-Axis Motorized Stage	MA-E2000	2	Table size: 125 × 125 mm; coarse travel: 50 mm, min step: 10 nm, repeatability: ±0.01 μm (with 50 nm encoder feedback), max speed: 20 mm/s. θX: ±6°, resolution: 0.0025°；θY: ±8°, 0.003°；θZ: ±8°, 0.0032°.
6-Axis Controller	TPL26	1	Integrated 6-axis motion controller and driver
Motion Control Software	SDK-01	1	Multi-mode software (step, point, scan); supports automated optical alignment. Includes modules for optical power and photoelectric current monitoring. Supports both horizontal and vertical coupling.
Custom Fixtures	ALF-D	1	For single/FA fiber arrays, horizontal or vertical. Supports waveguide chips, vacuum or mechanical mounting, TEC-compatible.
4-Axis Chip Stage	FDM30	1	X/Y travel: 13 mm, Z: 6 mm, with 360° rotation.
Microscopic Imaging	LMU-FL	2/3	Independent multi-dimensional high-performance imaging system Gantry-style multi-axis high-resolution observation system Optical magnification: 0.7–4.5×, up to 270× digital magnification, 1:7 zoom ratio 4D adjustment, 40 mm travel, stainless steel post mount, 86 mm working distance 2MP color digital camera, with imaging software supporting measurement, capture, video recording, and annotation Equipped with high-resolution display; objective lens supports 0–90° rotation (customizable based on application needs) For vertical FA coupling applications: equipped with three microscope modules, including an additional horizontal viewing path
Optical Table	PLGZT	1	Equipped with PLGZT high-precision damping isolation platform, size customizable. Optional: standard optical breadboard, darkroom shielding enclosure.
Probe Holders	TPLS-UN	2/4	- DC Probe Holder: With probe clamp, magnetic base, 3-axis adjustment (13 mm travel, 1 μm precision), with banana plug cable (male). - RF Probe Holder: With probe clamp, magnetic base, 3-axis adjustment (13 mm, 1 μm), articulated tilt stage for tip-to-pad alignment.
Optional Accessories	-	-	Includes light source, optical power meter, UV curing unit, epoxy dispenser, etc.

Software Interface:

Optical Device Coupling System↓

光器件耦合系统截图.jpg

Positioning System↓

位移系统界面.png

Coupling Feedback (Optical Power Meter)↓

光功率计平稳性观察.png

Coupling Workflow

Example: PLC Chip-to-Fiber Alignment

Mechanical Setup：Mount the fiber array and chip on the platform using fixtures. Align each component’s plane and height, ensuring coplanarity and initial positioning accuracy. Fine-tune all axes to minimize angular and positional offsets for optimal coupling.
Initial Optical Alignment：Perform coarse optical alignment along X and Y axes. Use live imaging (overlay of oblique and coaxial views) to assess misalignment. Adjust until the input/output ports of the fiber and chip are well aligned and focused. Light coupling signal appears on the CCD once aligned.
Visual Monitoring：With low-power light coupled into the device, monitor the near-field output (typ. 100–200 μm distance) to evaluate alignment. Adjust rotational angle and height as needed. Use image-based alignment and feedback to iteratively optimize coupling. Fine adjustments are made in ≤10 μm steps.
Signal Optimization：Inject signal light and monitor output power to perform fine tuning. Ensure coupling loss is minimized. Complete alignment of each channel one by one.
UV Curing：Once alignment is complete, apply UV curing to fix the device.
Device Removal：Release the fixture, remove the bonded device, and proceed to testing.

Application fields:

Widely applied in core fields such as scientific research and industrial production. coupling for silicon photonic waveguidesoptical fibers (single fiber / FA arrays)AWGWDMPLCcollimatorscovering a wide range of photonic integration needs.

PLCTS provides customized optical coupling solutions tailored to your specific application needs.For more information, please contact us directly.

标签：