Beam Quality Analyzer captures the cross-sectional beam profile at a given location for precise, quantitative analysis of intensity distribution, beam shape, and spot size. Using a high-speed CCD or CMOS sensor, it records pixel-by-pixel intensity data to reconstruct the overall beam profile and calculate results such as beam diameter and intensity centroid.
Offered by Pulim Optoelectronics, our analyzers support both real-time exposure and gain control, with integrated attenuation solutions. They are widely used in semiconductor, solid-state, fiber, and ultrafast lasers, as well as laser ranging.
Visible-Light Beam Quality Analyzer
Product Features:
- ● High resolution & small pixel size
- ● Compatible with pulsed & CW lasers
- ● Spot diameter range: 22 μm–22 mm
- ● Manual & automatic real-time exposure/gain control
- ● Compact design with bracket & attenuation
- ● High-speed USB 3.0 / GigE interface
Applications:
- ● Laser spot inspection
- ● Optical component QA
- ● Laser cavity alignment
- ● Beam path collimation
- ● Fiber coupling analysis
- ● Laser processing monitoring
Technical Specifications:
Model | BAS4.3-1100 | BAS7.1-1100 | BAS10.4-1100 | BAS15-1100 |
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Wavelength | 300–1100 nm | 300–1100 nm | 300–1100 nm | 300–1100 nm |
Sensor Size | 5.7×4.3 mm | 8.4×7.1 mm | 14.1×10.4 mm | 15.8×21 mm |
Pixel Size | 2.2 μm | 3.45 μm | 3.45 μm | 6 μm |
Min. Working Distance | 6 mm | 6 mm | 6 mm | 6 mm |
Exposure | 0.05–500 ms | 0.05–500 ms | 0.05–500 ms | 0.05–500 ms |
Shutter | Rolling | Global | Global | Global |
Spot Range | 22 μm–4.3 mm | 34.5 μm–7.1 mm | 34.5 μm–10.4 mm | 60 μm–15 mm |
Max. Power Density | 50 W/cm² (OD 3.5) | 50 W/cm² (OD 3.5) | 50 W/cm² (OD 3.5) | 50 W/cm² (OD 3.5) |
Interface | USB 3.0 | USB 3.0 | USB 3.0 | USB 3.0 |
Trigger | No | Yes | Yes | Yes |
Weight | <500 g | <500 g | <500 g | <500 g |
Near-Infrared Beam Quality Analyzer
Product Features:
- ● 400–1700 nm response range
- ● Real-time beam shape & position monitoring
- ● High resolution & accuracy
- ● USB 3.0 / GigE interface
- ● Compatible with CW & pulsed lasers
Applications:
- ● Infrared beam profiling
- ● Optoelectronic manufacturing control
- ● Laser testing & inspection
- ● Fiber inspection
- ● Laser process monitoring
Technical Specifications:
Model | BASN2.6-1700 | BASN5-1700 |
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Wavelength | 400–1700 nm | 400–1700 nm |
Sensor Size | 3.2×2.6 mm | 6.4×5.1 mm |
Pixel Size | 5×5 μm | 5×5 μm |
Sensor Type | InGaAs | InGaAs |
Resolution | 656×520 | 1280×1024 |
Spot Range | 50 μm–2.6 mm | 50 μm–5 mm |
Application Cases:

