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Chip stage fixtures are designed to secure chips with optional temperature control (TEC) and/or vacuum adsorption, ensuring reliable performance.
Chip stage fixtures are designed to secure chips with optional temperature control (TEC) and/or vacuum adsorption, ensuring reliable performance in research experiments and high-throughput testing. Different models combine TEC temperature control, vacuum adsorption, and mechanical clamping to meet diverse application needs.
| Parameters | Customizable based on chip size and user requirements |
| Description | Large open top space, ideal for thin chips and applications requiring multi-probe testing. |
| Parameters | Temperature Range: 10~85℃ Accuracy: ±0.02℃ Customizable based on chip size and specific requirements |
| Description | Integrated vacuum adsorption and temperature control, suitable for temperature-sensitive chips. Large open top space, ideal for thin chips and multi-probe testing. |
| Parameters | Customizable based on chip size and user requirements |
| Description | Equipped with both vacuum adsorption and mechanical clamping, adaptable for a wide range of chip applications. |
| Parameters | Temperature Range: 10~85℃ Accuracy: ±0.02℃ Customizable based on chip size and specific requirements |
| Description | Combines vacuum adsorption, mechanical clamping, and temperature control, suitable for temperature-sensitive and multi-purpose chip applications. |
